ForTii® Eco E11

30%ガラス強化, PA4T, 良流動, ハロゲンフリー&赤りんフリー, V-0認定 0.15 mm

一般情報

ForTii®は、ハロゲンフリーの難燃化が可能な画期的な高耐熱ポリアミドです。 電子、自動車、工業分野における過酷な用途に適します。
ForTii® Eco は、お客様が希望し必要とするものを確実に提供するために、主要OEM、 主要部品メーカーや業界リーダーとの緊密な協力によって開発された広範囲で多用途の製品ラインアップを揃えました。
それは高い特性とバランスと取れた性能を持つ広範かつ汎用性の高いポートフォリオを持つ高温ポリアミドを意味します。
製品

ForTii® Eco E11
has an excellent balance in flow, toughness and stiffness with superior
processing performance for injection molding. 
It has improved toughness and is suitable for SMT processes. Eco E11 has a high electrical RTI rating of 150°C at
0.75 mm and has CTI 600V. Eco E11 is Eco-friendly due to its partly bio-based
content.


特徴
各種規制
成形方法
Injection Molding
テクノロジー
Life cycle assessment

流動特性

成形収縮率 (流れ方向)
0.3
%
成形収縮率 (垂直方向)
1.2
%
スパイラルフロー 1.0 mm 1000 bar
145
mm

機械特性

引張弾性率
11500
MPa
引張弾性率 (-40℃)
12000
MPa
引張弾性率 (80°C)
9000
MPa
引張弾性率 (100°C)
7000
MPa
引張弾性率 (120℃)
5500
MPa
引張弾性率 (140℃)
4700
MPa
引張弾性率 (160℃)
4200
MPa
引張破断強度
155
MPa
引張破断強度 (-40℃)
180
MPa
引張破断強度 (80°C)
110
MPa
引張破断強度 (100℃)
85
MPa
引張破断強度 (120℃)
70
MPa
引張破断強度 (140℃)
60
MPa
引張破断強度 (160℃)
55
MPa
引張破断ひずみ
2.3
%
引張破断ひずみ (-40℃)
2.4
%
引張破断ひずみ (80°C)
2.8
%
引張破断ひずみ (100℃)
3.8
%
引張破断ひずみ (120℃)
4.5
%
引張破断ひずみ (140°C)
4.5
%
引張破断ひずみ (160℃)
4.5
%
曲げ弾性率
10000
MPa
曲げ強度
230
MPa
シャルピー衝撃強さ (23℃)
55
kJ/m²
シャルピー衝撃強さ ノッチ付き (23℃)
8
kJ/m²

熱的特性

融点 (10℃/min)
325
°C
荷重たわみ温度 (1.8MPa)
275
°C
荷重たわみ温度 (0.45MPa)
300
°C
線膨張係数 (流れ方向)
0.2
E-4/°C
線膨張係数 (垂直方向)
0.7
E-4/°C
面方向熱伝導率
0.41
W/(m K)
深さ方向熱伝導率
0.35
W/(m K)
1.5mm厚さでの燃焼性
V-0
class
UL認定
Yes
-
厚さhでの燃焼性
V-0
class
追加試験片の厚さ(h)
0.15
mm
UL認定
Yes
-
グローワイヤ燃焼性指数
960
°C
GWFI (厚さ (1))
3
mm
グローワイヤ燃焼性指数
960
°C
GWFI (厚さ (2))
0.4
mm
グローワイヤ着火温度
800
°C
GWIT (厚さ (1))
1.6
mm
グローワイヤ着火温度
750
°C
GWIT (厚さ (2))
0.8
mm
相対温度インデックス-電気
150
°C
RTI−電気 (厚さ(1))
0.75
mm
相対温度インデックス-電気
130
°C
RTI−電気 (厚さ(2))
0.2
mm

電気特性

誘電率 (1GHz)
3.7
-
誘電率 10GHz
3.6
-
誘電正接 1GHz
140
E-4
誘電正接 10GHz
100
E-4
体積固有抵抗率
>1E13
Ohm*m
表面抵抗率
Ohm
絶縁破壊強さ
33
kV/mm
耐トラッキング指数
600
V

その他特性

吸水率(水中)
4.2
%
吸水率 (23℃/50%R.H.)
1.4
%
密度
1450
kg/m³

図表

用途

Audio Jack Connectors

産業
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to its outstanding mechanical strength outperforming competitive materials for jacks by up to four times, therefore enabling 20.000-plus insertion/extraction cycles</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs</li> </ul>

DDR DIMM Connectors

産業
Electronics
  • <ul> <li>ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behaviour after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs)</li> <li>ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow</li> <li>ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flameretardants</li> </ul>

Reflow connectors

産業
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>

Reflow connectors (2)

産業
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>

Reflow connectors (3)

産業
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>