Novamid® 1010GH30 NAT

30% Glass Reinforced, Heat Stabilized, Injection Molding

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General Information

Novamid® is a high-quality polyamide, that has been developed as a special product line in order to cope with high demand levels from our Japanese customers.
Novamid® has seen various applications in various fields and various regions. From car to packaging, Novamid® is supported by an experienced and wide range of experts.
Special features
  • Heat stabilized
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Red Phosphorus2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Have a question? Contact us

Rheological properties

Melt volume-flow rate
31
cm³/10min
Temperature
250
°C
Load
2.16
kg
Molding shrinkage (parallel)
0.3
%
Molding shrinkage (normal)
1
%

Mechanical properties

Tensile modulus
9600
MPa
Stress at break
170
MPa
Strain at break
3.3
%
Flexural modulus
9200
MPa
Flexural strength
260
MPa
Charpy impact strength (+23°C)
81
kJ/m²
Charpy notched impact strength (+23°C)
12
kJ/m²

Thermal properties

Melting temperature (10°C/min)
220
°C
Temp. of deflection under load (1.80 MPa)
205
°C
Temp. of deflection under load (0.45 MPa)
220
°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.7
E-4/°C

Electrical properties

Surface resistivity
Ohm

Other properties

Humidity absorption
2
%
Density
1360
kg/m³