ForTii® TX1
30% Glass Reinforced, PA4T, Electro-friendly, Halogen free and free of red phosphorous, Certified V-0 at 0.35mm
General Information
ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
ForTii® TX1 has robust mechanical & JEDEC Level 2 performance, enabling SMT process without deformation and low risk on blistering. TX1 has stable processing behavior and is suitable for typical consumer electronics connector manufacturing such as I/O, FPC and WTB connectors.
Special features
- Phosphorous free
General Document
Regulatory Affairs
- Absence Declaration BNST2023-11-16
- Absence Declaration Biocidal Products2023-11-16
- Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
- Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
- Absence Declaration EPA 20 High Priority Substances 20192023-11-16
- Absence Declaration Food Allergens2023-11-16
- Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
- Absence Declaration Nano Materials2023-11-16
- Absence Declaration Ozone Depleting Chemicals2023-11-16
- Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
- Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
- Absence Declaration PFAS2024-03-05
- Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
- Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
- Absence Declaration Red Phosphorus2023-11-16
- Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
- CALIFORNIA PROPOSITION 65 (NDS)2024-01-02
- Conflict minerals declaration (EICC, GeSI)2024-03-21
- Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
- REACH Registration Statement2024-03-27
- REACH STATEMENT KOREA2023-11-16
- REACH STATEMENT TURKYE2023-11-16
- RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
- SVHC, REACH Annex XIV and –XVII Statement2024-03-27
- Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Injection Molding
Automotive OEM
HYUNDAI KIA
HYUNDAI KIA
OEM Specification
MS-941-03-(2022)
MS-941-03-(2022)
Rheological properties
Molding shrinkage (parallel)
0.35
%
ISO 294-4
Molding shrinkage (normal)
1.2
%
ISO 294-4
Spiral flow length 1.0 mm 800 bar
110
mm
-
Spiral flow length 1.0 mm 900 bar
120
mm
-
Spiral flow length 1.0 mm 1000 bar
130
mm
-
Mechanical properties
Tensile modulus
11500
MPa
ISO 527-1/-2
Tensile modulus (120°C)
8000
MPa
ISO 527-1/-2
Tensile modulus (160°C)
5000
MPa
ISO 527-1/-2
Tensile modulus, low thickness
10700
MPa
ISO 527-1/-2
Tens. Mod. (Thickness tested)
1
mm
ISO 527-1/-2
Stress at break
150
MPa
ISO 527-1/-2
Stress at break (120°C)
95
MPa
ISO 527-1/-2
Stress at break (160°C)
65
MPa
ISO 527-1/-2
Stress at break, at low thickness
155
MPa
ISO 527-1/-2
Stress at break (Thickness tested)
1
mm
ISO 527-1/-2
Strain at break
2
%
ISO 527-1/-2
Strain at break (120°C)
2.5
%
ISO 527-1/-2
Strain at break (160°C)
3.6
%
ISO 527-1/-2
Strain at break, at low thickness
2.1
%
ISO 527-1/-2
Strain at break (Thickness tested)
1
mm
ISO 527-1/-2
Flexural modulus
11000
MPa
ISO 178
Flexural strength
240
MPa
ISO 178
Charpy impact strength (+23°C)
47
kJ/m²
ISO 179/1eU
Charpy notched impact strength (+23°C)
7
kJ/m²
ISO 179/1eA
Weldline strength at thickness 2
60
MPa
ISO 527-1/-2
Weldline strain at thickness 2
0.7
%
ISO 527-1/-2
Thickness tested (2)
1
mm
ISO 527-1/-2
Thermal properties
Melting temperature (10°C/min)
325
°C
ISO 11357-1/-3
Glass transition temperature (10°C/min)
125
°C
ISO 11357-1/-2
Temp. of deflection under load (1.80 MPa)
305
°C
ISO 75-1/-2
Temp. of deflection under load (0.45 MPa)
323
°C
ISO 75-1/-2
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
ISO 11359-1/-2
Coeff. of linear therm. expansion (normal)
0.65
E-4/°C
ISO 11359-1/-2
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
ASTM D696
Coeff. of linear therm. expansion (normal)
0.35
E-4/°C
ASTM D696
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
IEC 60695-11-10
Thickness tested
1.5
mm
IEC 60695-11-10
UL recognition
Yes
-
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
IEC 60695-11-10
Thickness tested
3
mm
IEC 60695-11-10
UL recognition
Yes
-
-
Oxygen index
39
%
ISO 4589-1/-2
Ball pressure temperature
305
°C
IEC 60695-10-2
Glow Wire Flammability Index GWFI
960
°C
IEC 60695-2-12
GWFI (Thickness (1) tested)
3
mm
IEC 60695-2-12
Glow Wire Flammability Index GWFI
960
°C
IEC 60695-2-12
GWFI (Thickness (2) tested)
0.75
mm
IEC 60695-2-12
Glow Wire Ignition Temperature GWIT
800
°C
IEC 60695-2-13
GWIT (Thickness (1) tested)
3
mm
IEC 60695-2-13
Glow Wire Ignition Temperature GWIT
800
°C
IEC 60695-2-13
GWIT (Thickness (2) tested)
0.75
mm
IEC 60695-2-13
Relative Temperature Index - electrical
130
°C
UL746B
RTI electrical (Thickness (1) tested)
0.75
mm
UL746B
Relative Temperature Index - electrical
120
°C
UL746B
RTI electrical (Thickness (2) tested)
0.35
mm
UL746B
Relative Temperature Index - with impact
110
°C
UL746B
RTI with impact (Thickness (1) tested)
0.75
mm
UL746B
Relative Temperature Index - with impact
120
°C
UL746B
RTI with impact (Thickness (2) tested)
1.5
mm
UL746B
Relative Temperature Index - without impact
120
°C
UL746B
RTI without impact (Thickness (1) tested)
0.75
mm
UL746B
Relative Temperature Index - without impact
130
°C
UL746B
RTI without impact (Thickness (2) tested)
1.5
mm
UL746B
Electrical properties
Relative permittivity (100Hz)
4.2
-
IEC 62631-2-1
Relative permittivity (1 MHz)
3.9
-
IEC 62631-2-1
Relative permittivity (1GHz)
3.8
-
IEC 61189-2-721
Dissipation factor (100 Hz)
64
E-4
IEC 62631-2-1
Dissipation factor (1 MHz)
176
E-4
IEC 62631-2-1
Dissipation factor (1GHz)
130
E-4
IEC 61189-2-721
Electric strength
33
kV/mm
IEC 60243-1
Comparative tracking index
600
V
IEC 60112
Comparative Tracking Index (above 600V)
≥800V
V
Sim. to IEC 60112
Other properties
Water absorption
4.1
%
Sim. to ISO 62
Water absorption in water at 23°C after 24h
0.3
%
ISO 62
Humidity absorption
1.6
%
Sim. to ISO 62
Density
1460
kg/m³
ISO 1183
Material specific properties
Viscosity number
86
cm³/g
ISO 307, 1157, 1628
Diagrams
Applications
Audio Jack Connectors
Industry
Electronics
- •} Cost-effective
- •} High flowability
- •} Low moisture absorption
- •} Flame retardant
Automotive Reflow Connectors
Industry
Automotive
- •} Reliable
- •} High temperature resistant
- •} High melting point
- •} Cost effective
- •} High co-planarity
- •} Low warpage after soldering
- •} High mechanical performance
- •} High flowability enables thin wall designs
DDR DIMM Connectors
Industry
Electronics
- •} Sustainable solution due to good carbon footprint
- •} Flame retardant
- •} Halogen-free
- •} Red-phosphorous free
Fakra connectors
Industry
Automotive
- •} Reflow soldering
- •} High weldline strength vs other PPAs
- •} Broad color portfolio
- •} For JTX8 solid JEDEC1 performance
- •} High material flow
High voltage connector
Industry
Automotive
Material
Application requirements
Superior electrical performance
Dedicated high voltage
High mechanical strength
Material properties
CTI 600V, RTI 140°C
Halogen-free
UL94-V0 @ 0.75mm
Superior processability}
Power Connectors
Industry
Electronics
Material
- •} Good processability
- •} High flowability
- •} Enables thin-walled designs
- •} Sustainable solution
- •} Lower carbon footprint
Reflow connectors (3)
Industry
Electronics
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
