ForTii® NMX33

50% Glass Reinforced, PA4T, Suitable for NMT, Suitable for PVD

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® NMX33 offers excellent adhesion to NMT treated metals and high mechanical performance in metal/plastics bonding. NMX33 also has a high HDT resulting in a good thermal resistance, supporting high temperature secondary processes such as high temperature PVD.


Special features
Regulatory Affairs
Processing technology
Injection Molding
Applications

Rheological properties

Molding shrinkage (parallel)
0.2
%
Molding shrinkage (normal)
0.7
%
Spiral flow length 1.0 mm 1000 bar
70
mm

Mechanical properties

Tensile modulus
17500
MPa
Tensile modulus, low thickness
17500
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
280
MPa
Stress at break, at low thickness
270
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.4
%
Strain at break, at low thickness
2.5
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
16500
MPa
Flexural strength
400
MPa
Charpy impact strength (+23°C)
90
kJ/m²
Charpy notched impact strength (+23°C)
14.5
kJ/m²
Weldline strength at thickness 1
110
MPa
Weldline strain at thickness 1
0.9
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
105
MPa
Weldline strain at thickness 2
0.9
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
315
°C
Temp. of deflection under load (1.80 MPa)
245
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.5
E-4/°C
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-

Electrical properties

Relative permittivity (1GHz)
4.3
-
Dissipation factor (1GHz)
140
E-4
Electric strength
28
kV/mm

Other properties

Water absorption
4.2
%
Humidity absorption
1.6
%
Density
1640
kg/m³

Diagrams

Applications

Mobile Phone Mid-Frame

Industry
Electronics
Material
Envalior offers a complete range of resins that support the Mobile Phone mid-frame, produced using NMT (nano-molding technology). Due to the roll-out of 5G networks, the mid-frame needs to be more robust. Besides supporting a wider front display glass panel, it holds up a glass or ceramic back panel. To achieve better reliability, metals such as Stainless Steel or even Titanium, that are harder, stronger, and more resilient (cf Al) are being selected. Furthermore, for higher rigidity and impact performance, ForTii and ForTii Ace offer excellent adhesion performances when combined with NMT onto Stainless Steel or Titanium. In addition, due to ForTii and ForTii Ace having a higher thermal stability, finishing processes, such as high temp PVD (physical vapor deposition), it could be considered to achieve a wider aesthetic finishing, that is also more durable.}