ForTii® LDS85B

30% Glass Reinforced, PA4T, Laser Direct Structuring (LDS)

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® LDS85B enables mechanical function integration with high impact resistance and ductility. LDS85B has very good plating performance.


Special features
  • Laser Direct Structuring
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2024-04-25
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.33
%
Molding shrinkage (normal)
1.3
%
Spiral flow length 1.0 mm 1000 bar
90
mm

Mechanical properties

Tensile modulus
10000
MPa
Tensile modulus (120°C)
5600
MPa
Tensile modulus (160°C)
3000
MPa
Tensile modulus, low thickness
10000
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
125
MPa
Stress at break (120°C)
64
MPa
Stress at break (160°C)
45
MPa
Stress at break, at low thickness
130
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
2.1
%
Strain at break (120°C)
4
%
Strain at break (160°C)
6
%
Strain at break, at low thickness
2.2
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
9400
MPa
Flexural modulus (120°C)
5400
MPa
Flexural modulus (160°C)
3100
MPa
Flexural strength
185
MPa
Flexural strength (120°C)
100
MPa
Flexural strength (160°C)
70
MPa
Charpy impact strength (+23°C)
35
kJ/m²
Charpy notched impact strength (+23°C)
4
kJ/m²
Weldline strength at thickness 1
70
MPa
Weldline strain at thickness 1
1
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
50
MPa
Weldline strain at thickness 2
0.6
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Temp. of deflection under load (1.80 MPa)
285
°C
Temp. of deflection under load (0.45 MPa)
315
°C
Coeff. of linear therm. expansion (parallel)
0.18
E-4/°C
Coeff. of linear therm. expansion (normal)
0.6
E-4/°C
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-

Electrical properties

Relative permittivity (1GHz)
3.78
-
Relative permittivity (5GHz)
3.73
-
Dissipation factor (1GHz)
160
E-4
Dissipation factor (5GHz)
140
E-4

Other properties

Water absorption
3.5
%
Water absorption in water at 23°C after 24h
0.28
%
Humidity absorption
1.4
%
Density
1510
kg/m³

Diagrams

Applications

Robotic connectors & circuitry

Industry
Robotics
Material
  • •} Stanyl® and ForTii® are proven solutions for connectors used by many of the world's leading automakers and electronics manufacturers.
  • •} Superior strength and durability vs liquid crystal polymers (LCP) and other thermoplastics.
  • •} Material solutions formulated for laser direct structuring for precision processing.
}
More information

T10 LDS sockets

Industry
Automotive
Material
Reflow capable / LDS solution fits automotive environment}
More information

WeLDS Radar Housing

Industry
Electronics
Material
  • •} Conductive track by LDS
  • •} Good aesthetics
  • •} Cover PPA laserwelded
}
More information