ForTii® LDS51B

30% Glass Reinforced, PA4T, Halogen free and free of red phosphorous, Certified V-0 at 0.4mm, Laser Direct Structuring (LDS)

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® LDS51B is a truly reflow compatible and halogen-free flame retardancy grade. LDS51B has superior plating performance and is compatible with a broad range of laser settings enabling high resolution and fine line capability.


Special features
  • Laser Direct Structuring
  • Phosphorous free
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
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Rheological properties

Molding shrinkage (parallel)
0.3
%
Molding shrinkage (normal)
1
%

Mechanical properties

Tensile modulus
11500
MPa
Tensile modulus (120°C)
6000
MPa
Tensile modulus (160°C)
3100
MPa
Tensile modulus, low thickness
11500
MPa
Tens. Mod. (Thickness tested)
1
mm
Stress at break
110
MPa
Stress at break (120°C)
57
MPa
Stress at break (160°C)
37
MPa
Stress at break, at low thickness
110
MPa
Stress at break (Thickness tested)
1
mm
Strain at break
1.6
%
Strain at break (120°C)
3
%
Strain at break (160°C)
5
%
Strain at break, at low thickness
1.6
%
Strain at break (Thickness tested)
1
mm
Flexural modulus
11300
MPa
Flexural modulus (120°C)
6400
MPa
Flexural modulus (160°C)
3600
MPa
Flexural strength
165
MPa
Flexural strength (120°C)
90
MPa
Flexural strength (160°C)
60
MPa
Charpy impact strength (+23°C)
26
kJ/m²
Charpy notched impact strength (+23°C)
3
kJ/m²
Weldline strength at thickness 1
55
MPa
Weldline strain at thickness 1
0.7
%
Thickness tested (1)
4
mm
Weldline strength at thickness 2
55
MPa
Weldline strain at thickness 2
0.6
%
Thickness tested (2)
1
mm

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Temp. of deflection under load (1.80 MPa)
290
°C
Temp. of deflection under load (0.45 MPa)
310
°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.4
E-4/°C

Electrical properties

Relative permittivity (1GHz)
4.13
-
Relative permittivity (5GHz)
4.06
-
Dissipation factor (1GHz)
210
E-4
Dissipation factor (5GHz)
165
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Comparative tracking index
400
V

Other properties

Water absorption
3.3
%
Humidity absorption
1.3
%
Density
1580
kg/m³

Diagrams