ForTii® K12

40% Glass Reinforced, PA4T, Electro-friendly

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General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product
ForTii® K12 combines high mechanical strength and good flowability, ideal for designs requiring dimensional stability and impact resistance. K12 is suitable for applications such as sensor housing or camera bracket.

Special features
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.35
%
Molding shrinkage (normal)
1
%
Spiral flow length 1.0 mm 1000 bar
100
mm

Mechanical properties

Tensile modulus
13500
MPa
Stress at break
210
MPa
Strain at break
2
%
Flexural modulus
13500
MPa
Flexural strength
330
MPa
Charpy impact strength (+23°C)
65
kJ/m²
Charpy notched impact strength (+23°C)
11
kJ/m²

Thermal properties

Melting temperature (10°C/min)
325
°C
Glass transition temperature (10°C/min)
125
°C
Temp. of deflection under load (1.80 MPa)
305
°C
Temp. of deflection under load (0.45 MPa)
320
°C
Coeff. of linear therm. expansion (parallel)
0.3
E-4/°C
Coeff. of linear therm. expansion (normal)
0.4
E-4/°C
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-

Electrical properties

Relative permittivity (100Hz)
5
-
Relative permittivity (1 MHz)
4.5
-
Dissipation factor (100 Hz)
120
E-4
Dissipation factor (1 MHz)
250
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
33
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
4.4
%
Humidity absorption
1.7
%
Density
1530
kg/m³

Diagrams

Applications

Reflow connectors (3)

Industry
Electronics
Material
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
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