ForTii® Eco E11

30% Glass Reinforced, PA4T, Good Flow, Halogen free and free of red phosphorous, Certified V-0 at 0.15mm

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® Eco in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® Eco E11
has an excellent balance in flow, toughness and stiffness with superior
processing performance for injection molding. 
It has improved toughness and is suitable for SMT processes. Eco E11 has a high electrical RTI rating of 150°C at
0.75 mm and has CTI 600V. Eco E11 is Eco-friendly due to its partly bio-based
content.


Special features
Regulatory Affairs
Processing technology
Injection Molding
Design challenge
Life cycle assessment

Rheological properties

Molding shrinkage (parallel)
0.3
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 1000 bar
145
mm

Mechanical properties

Tensile modulus
11500
MPa
Tensile modulus (-40°C)
12000
MPa
Tensile modulus (80°C)
9000
MPa
Tensile modulus (100°C)
7000
MPa
Tensile modulus (120°C)
5500
MPa
Tensile modulus (140°C)
4700
MPa
Tensile modulus (160°C)
4200
MPa
Stress at break
155
MPa
Stress at break (-40°C)
180
MPa
Stress at break (80°C)
110
MPa
Stress at break (100°C)
85
MPa
Stress at break (120°C)
70
MPa
Stress at break (140°C)
60
MPa
Stress at break (160°C)
55
MPa
Strain at break
2.3
%
Strain at break (-40°C)
2.4
%
Strain at break (80°C)
2.8
%
Strain at break (100°C)
3.8
%
Strain at break (120°C)
4.5
%
Strain at break (140°C)
4.5
%
Strain at break (160°C)
4.5
%
Flexural modulus
10000
MPa
Flexural strength
230
MPa
Charpy impact strength (+23°C)
55
kJ/m²
Charpy notched impact strength (+23°C)
8
kJ/m²

Thermal properties

Melting temperature (10°C/min)
325
°C
Temp. of deflection under load (1.80 MPa)
275
°C
Temp. of deflection under load (0.45 MPa)
300
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.7
E-4/°C
Thermal conductivity in plane
0.41
W/(m K)
Thermal conductivity through plane
0.35
W/(m K)
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
UL recognition
Yes
-
Burning Behav. at thickness h
V-0
class
Thickness tested
0.15
mm
UL recognition
Yes
-
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
3
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
0.4
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (1) tested)
1.6
mm
Glow Wire Ignition Temperature GWIT
750
°C
GWIT (Thickness (2) tested)
0.8
mm
Relative Temperature Index - electrical
150
°C
RTI electrical (Thickness (1) tested)
0.75
mm
Relative Temperature Index - electrical
130
°C
RTI electrical (Thickness (2) tested)
0.2
mm

Electrical properties

Relative permittivity (1GHz)
3.7
-
Relative permittivity (10GHz)
3.6
-
Dissipation factor (1GHz)
140
E-4
Dissipation factor (10GHz)
100
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
33
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
4.2
%
Humidity absorption
1.4
%
Density
1450
kg/m³

Diagrams

Applications

Audio Jack Connectors

Industry
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to its outstanding mechanical strength outperforming competitive materials for jacks by up to four times, therefore enabling 20.000-plus insertion/extraction cycles</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions to due good processability and high flowability enabling thin walled designs</li> </ul>

DDR DIMM Connectors

Industry
Electronics
  • <ul> <li>ForTii® PA4T allows for reliable solutions due to its excellent stiffness and high deflection temperature under load (HDT) and its excellent low warpage behaviour after reflow soldering, outperforming Liquid Crystal Polymer (LCPs) and polyphthalamides (PPAs)</li> <li>ForTii® enables DDR manufacturers to produce more cost effective applications with reduced weight and height, enabling easy rework at lower temperature loads, with fewer heat traps and better thermal airflow</li> <li>ForTii® PA4T allows for sustainable solutions due to its good carbon footprint and due the use of halogen and red-phosphorous free flameretardants</li> </ul>

Reflow connectors

Industry
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>

Reflow connectors (2)

Industry
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>

Reflow connectors (3)

Industry
Electronics
  • <ul> <li>Stanyl® PA46 and ForTii® PA4T allow for reliable solutions due to their high melting temperatures (allowing the use of high reflow temperatures) and high mechanical performance (implying a reduced reject rate during pin assembly + meeting mechanical specification also after reflow soldering)</li> <li>ForTii® PA4T increases the reliability even due to a high dimensional stability, a low and isotropic CLTE leading to high co-planarity and low warpage after soldering</li> <li>Stanyl® PA46 and ForTii® PA4T allow for cost effective solutions due to their ease of processability and flowability (enabling thin wall designs)</li> </ul>