ForTii® Eco E11

30% Glass Reinforced, PA4T, Good Flow, Halogen free and free of red phosphorous, Certified V-0 at 0.15mm

Back to results

General Information

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® Eco in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.
Product

ForTii® Eco E11 has an excellent balance in flow, toughness and stiffness with superior processing performance for injection molding.  It has improved toughness and is suitable for SMT processes. Eco E11 has a high electrical RTI rating of 150°C at 0.75 mm and has CTI 600V. Eco E11 is Eco-friendly due to its partly bio-based content.


Sustainability
Bio-based
Special features
  • Good or high flow
  • Phosphorous free
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Design challenge
Life cycle assessment
Applications
Have a question? Contact us

Rheological properties

Molding shrinkage (parallel)
0.35
%
Molding shrinkage (normal)
1.2
%
Spiral flow length 1.0 mm 1000 bar
145
mm

Mechanical properties

Tensile modulus
11500
MPa
Tensile modulus (-40°C)
12000
MPa
Tensile modulus (80°C)
9000
MPa
Tensile modulus (100°C)
7000
MPa
Tensile modulus (120°C)
5500
MPa
Tensile modulus (140°C)
4700
MPa
Tensile modulus (160°C)
4200
MPa
Stress at break
155
MPa
Stress at break (-40°C)
180
MPa
Stress at break (80°C)
110
MPa
Stress at break (100°C)
85
MPa
Stress at break (120°C)
70
MPa
Stress at break (140°C)
60
MPa
Stress at break (160°C)
55
MPa
Strain at break
2.3
%
Strain at break (-40°C)
2.4
%
Strain at break (80°C)
2.8
%
Strain at break (100°C)
3.8
%
Strain at break (120°C)
4.5
%
Strain at break (140°C)
4.5
%
Strain at break (160°C)
4.5
%
Flexural modulus
10000
MPa
Flexural strength
230
MPa
Charpy impact strength (+23°C)
55
kJ/m²
Charpy notched impact strength (+23°C)
8
kJ/m²

Thermal properties

Melting temperature (10°C/min)
325
°C
Temp. of deflection under load (1.80 MPa)
275
°C
Temp. of deflection under load (0.45 MPa)
300
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.7
E-4/°C
Thermal conductivity in plane
0.41
W/(m K)
Thermal conductivity through plane
0.35
W/(m K)
Burning Behav. at 1.5 mm nom. thickn.
V-0
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
V-0
class
Thickness tested
3
mm
UL recognition
Yes
-
Ball pressure temperature
270
°C
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (1) tested)
3
mm
Glow Wire Flammability Index GWFI
960
°C
GWFI (Thickness (2) tested)
0.4
mm
Glow Wire Ignition Temperature GWIT
800
°C
GWIT (Thickness (1) tested)
1.6
mm
Glow Wire Ignition Temperature GWIT
750
°C
GWIT (Thickness (2) tested)
0.8
mm
Relative Temperature Index - electrical
150
°C
RTI electrical (Thickness (1) tested)
0.75
mm
Relative Temperature Index - electrical
130
°C
RTI electrical (Thickness (2) tested)
0.2
mm

Electrical properties

Relative permittivity (1GHz)
3.7
-
Relative permittivity (10GHz)
3.6
-
Dissipation factor (1GHz)
140
E-4
Dissipation factor (10GHz)
100
E-4
Volume resistivity
>1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
33
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
3.9
%
Humidity absorption
1.4
%
Density
1450
kg/m³

Diagrams

Applications

Audio Jack Connectors

Industry
Electronics
Material
  • •} Cost-effective
  • •} High flowability
  • •} Low moisture absorption
  • •} Flame retardant
}
More information

DDR DIMM Connectors

Industry
Electronics
Material
  • •} Sustainable solution due to good carbon footprint
  • •} Flame retardant
  • •} Halogen-free
  • •} Red-phosphorous free
}
More information

Reflow connectors

Industry
Electronics
Material
  • •} Cost-effective
  • •} High flowability
  • •} Enable thin-wall designs
  • •} Low moisture absorption
  • •} Flame retardant
}
More information

Reflow connectors (2)

Industry
Electronics
Material
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
More information

Reflow connectors (3)

Industry
Electronics
Material
PA46, PA4T excellent flow (> PEEK, PPA) PA4T low moisture absorption}
More information