Akulon® S223-HG3

15% Glass Reinforced, Heat Stabilized

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General Information

Akulon® is our family of high performance polyamide 6 and polyamide 66 materials, used by customers across the world in applications ranging from automotive, electronics & electrical, to furniture and packaging.
We offer Akulon® grades for injection molding, blow molding and extrusion (including barrier film, stock shapes, convoluted tubes, and mono and multi filament).
In molded parts the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile for extrusion the strength, resilience and easy processing of Akulon® sets the market standards.
Special features
  • Heat stabilized
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
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Rheological properties

Molding shrinkage (parallel)
1
%
Molding shrinkage (normal)
1.5
%

Mechanical properties

Tensile modulus
6500
MPa
Stress at break
115
MPa
Strain at break
3
%
Flexural modulus
5100
MPa
Flexural strength
175
MPa
Charpy notched impact strength (+23°C)
5
kJ/m²
Charpy notched impact strength (-30°C)
3.5
kJ/m²

Thermal properties

Melting temperature (10°C/min)
260
°C
Temp. of deflection under load (1.80 MPa)
240
°C
Temp. of deflection under load (0.45 MPa)
255
°C
Burning Behav. at 1.5 mm nom. thickn.
HB
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-
Burning Behav. at 0.75 mm nom. thickn.
HB
class
Thickness tested
0.75
mm
Relative Temperature Index - electrical
140
°C
RTI electrical (Thickness (1) tested)
0.71
mm
Relative Temperature Index - electrical
140
°C
RTI electrical (Thickness (2) tested)
3
mm
Relative Temperature Index - with impact
120
°C
RTI with impact (Thickness (1) tested)
0.71
mm
Relative Temperature Index - with impact
130
°C
RTI with impact (Thickness (2) tested)
3
mm
Relative Temperature Index - without impact
120
°C
RTI without impact (Thickness (1) tested)
0.71
mm
Relative Temperature Index - without impact
130
°C
RTI without impact (Thickness (2) tested)
3
mm

Other properties

Water absorption
7.8
%
Humidity absorption
2
%
Density
1250
kg/m³