Akulon® S223-G6

30% Glass Reinforced

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General Information

Akulon® is our family of high performance polyamide 6 and polyamide 66 materials, used by customers across the world in applications ranging from automotive, electronics & electrical, to furniture and packaging.
We offer Akulon® grades for injection molding, blow molding and extrusion (including barrier film, stock shapes, convoluted tubes, and mono and multi filament).
In molded parts the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile for extrusion the strength, resilience and easy processing of Akulon® sets the market standards.
Special features
General Document
Regulatory Affairs
  • Absence Declaration BNST2023-11-16
  • Absence Declaration Biocidal Products2023-11-16
  • Absence Declaration DMF (2009/251/EC: Dimethylfumarate)2023-11-16
  • Absence Declaration ELV (2000/53/EC: Heavy metals)2024-02-15
  • Absence Declaration EPA 20 High Priority Substances 20192023-11-16
  • Absence Declaration Food Allergens2023-11-16
  • Absence Declaration NMP (N-Methylpyrrolidone)2023-11-16
  • Absence Declaration Nano Materials2023-11-16
  • Absence Declaration Ozone Depleting Chemicals2023-11-16
  • Absence Declaration PAH (Polycyclic Aromatic Hydrocarbons)2023-11-16
  • Absence Declaration PBT chemicals under TSCA section 6(h)2023-11-16
  • Absence Declaration PFAS2024-03-05
  • Absence Declaration POPs (Persistent Organic Pollutants)2023-10-27
  • Absence Declaration Phthalates (2005/84/EC: DEHP, DBP, BBP,DINP,DIDP, DNOP)2023-11-16
  • Absence Declaration Red Phosphorus2023-11-16
  • Absence Declaration opBDE (2003/11/EC: Octa- / Pentabromodiphenylether)2023-11-16
  • CALIFORNIA PROPOSITION 65 (NDS)2024-01-02
  • Conflict minerals declaration (EICC, GeSI)2024-03-21
  • Packaging, Packaging Waste and CONEG declaration (94/62/EC)2021-12-06
  • REACH Registration Statement2024-03-27
  • REACH STATEMENT KOREA2023-11-16
  • REACH STATEMENT TURKYE2023-11-16
  • RoHS Statement (2011/65/EC: Heavy metals)2024-02-01
  • SVHC, REACH Annex XIV and –XVII Statement2024-03-27
  • Turkish customs legislation info letter (EK-8 form)2023-11-16
Yellow Card
Processing technology
Injection Molding
Automotive OEM
MERCEDES
OEM Specification
DBL 5410.00 (2010-08)
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Rheological properties

Molding shrinkage [parallel]
0.2
%
Molding shrinkage [normal]
1.2
%

Mechanical properties

Tensile modulus
10000
MPa
Tensile modulus (-40°C)
10500
MPa
Tensile modulus (100°C)
4850
MPa
Stress at break
205
MPa
Stress at break (-40°C)
255
MPa
Stress at break (100°C)
110
MPa
Strain at break
3.6
%
Strain at break (-40°C)
3.4
%
Flexural modulus
9300
MPa
Flexural strength
295
MPa
Charpy impact strength (+23°C)
80
kJ/m²
Charpy impact strength (-30°C)
70
kJ/m²
Charpy notched impact strength (+23°C)
12
kJ/m²
Charpy notched impact strength (-30°C)
10
kJ/m²
Weldline strength at thickness 1
100
MPa
Weldline strain at thickness 1
1.4
%
Thickness tested (1)
4
mm

Thermal properties

Melting temperature (10°C/min)
260
°C
Temp. of deflection under load (1.80 MPa)
245
°C
Temp. of deflection under load (0.45 MPa)
260
°C
Coeff. of linear therm. expansion (parallel)
0.2
E-4/°C
Coeff. of linear therm. expansion (normal)
0.7
E-4/°C
Burning Behav. at 1.5 mm nom. thickn.
HB
class
Thickness tested
1.5
mm
UL recognition
Yes
-
Burning Behav. at 3.0 mm nom. thickn.
HB
class
Thickness tested
3
mm
UL recognition
Yes
-
Relative Temperature Index - electrical
65
°C
RTI electrical (Thickness (1) tested)
0.71
mm
Relative Temperature Index - electrical
65
°C
RTI electrical (Thickness (2) tested)
3
mm
Relative Temperature Index - with impact
65
°C
RTI with impact (Thickness (1) tested)
0.71
mm
Relative Temperature Index - with impact
65
°C
RTI with impact (Thickness (2) tested)
3
mm
Relative Temperature Index - without impact
65
°C
RTI without impact (Thickness (1) tested)
0.71
mm
Relative Temperature Index - without impact
65
°C
RTI without impact (Thickness (2) tested)
3
mm

Electrical properties

Relative permittivity (100Hz)
3.8
-
Relative permittivity (1 MHz)
3.5
-
Dissipation factor (100 Hz)
90
E-4
Dissipation factor (1 MHz)
160
E-4
Volume resistivity
1E13
Ohm*m
Surface resistivity
Ohm
Electric strength
30
kV/mm
Comparative tracking index
600
V

Other properties

Water absorption
6
%
Humidity absorption
1.6
%
Density
1360
kg/m³

Rheological calculation properties

Thermal conductivity of melt
0.172
W/(m K)
Spec. heat capacity melt
2170
J/(kg K)

Diagrams